HiPower 5.0
DENPAFLUX is proud to contribute EMC expertise to HiPower 5.0, a Chips Joint Undertaking project advancing highly efficient eDrive technologies for the automotive and maritime sectors.
HiPower 5.0 will deliver breakthroughs across several key areas, including:
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New GaN materials
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Advanced packaging and integration technologies
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Digital and eco-design tools, including life-cycle assessment (LCA) tools
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Innovative control strategies
These developments form the foundation for Power Electronics 5.0.
HiPower 5.0 is a three-year European research and innovation project launched on 1 July 2025, bringing together 45 partners from 11 countries with a total budget of €58 million.
About HiPower 5.0
Vision
The vision of HiPower 5.0 is to unlock the full potential of gallium nitride (GaN) and silicon carbide (SiC) devices to achieve major improvements in the performance, reliability, and sustainability of electric drivetrain components.
By enabling higher efficiency and longer lifetime of power electronics systems, the project aims to:
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Reduce greenhouse gas emissions from transport
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Enhance energy efficiency and energy security
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Strengthen an all-European integrated value chain — from semiconductor development to final mobility applications
This approach supports Europe’s transition towards clean, sustainable, and competitive mobility technologies.
Role of DENPAFLUX in HiPower 5.0
DENPAFLUX contributes to HiPower 5.0 by supporting the achievement of the project’s Electromagnetic Compatibility (EMC) goals.
Our involvement focuses on design-stage EMC support, including:
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Identifying potential EMC problems early in the design phase
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Proposing different solution options to address these risks, while respecting the overall technical goals of the project
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Supporting the design and modelling of EMC filters
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Supporting the design and modelling of Printed Circuit Boards (PCBs), which have a significant impact on system-level EMC performance
Through this work, DENPAFLUX helps keep EMC risks low and increases the likelihood of getting EMC right the first time.
Acknowledgement
The HiPower 5.0 Project (Grant Agreement No. 101194250) is supported by the Chips Joint Undertaking and its members, including the top-up funding by Austria, Belgium, the Czech Republic, Denmark, France, Germany, Italy, the Netherlands, Slovakia, and Slovenia. Co-funded by the European Union.
Views and opinions expressed are, however, those of the author(s) only and do not necessarily reflect those of the European Union, Chips JU, or the national granting authorities. Neither the European Union nor the granting authorities can be held responsible for them.